70V25TL20J8
vs
70V25TS20JGI
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
20 ns
|
20 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PQCC-J84
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
e3
|
| Memory Density |
131072 bit
|
131072 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
84
|
84
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
8KX16
|
8KX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC84,1.2SQ
|
LDCC84,1.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.0025 A
|
0.015 A
|
| Standby Voltage-Min |
3 V
|
3 V
|
| Supply Current-Max |
0.175 mA
|
0.225 mA
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
MATTE TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 70V25TL20J8 with alternatives
Compare 70V25TS20JGI with alternatives