70V25L15PFG8
vs
7025L15FG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
Pin Count
100
Manufacturer Package Code
PNG100
Reach Compliance Code
compliant
compliant
ECCN Code
NLR
EAR99
HTS Code
8542320041
8542.32.00.41
Factory Lead Time
18 Weeks
Samacsys Manufacturer
Renesas Electronics
Access Time-Max
15 ns
15 ns
I/O Type
COMMON
JESD-30 Code
S-PQFP-G100
S-PQFP-F84
JESD-609 Code
e3
Length
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
100
84
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX16
8KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFF
Package Equivalence Code
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.0025 A
Standby Voltage-Min
3 V
Supply Current-Max
0.185 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
FLAT
Terminal Pitch
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
Base Number Matches
1
3
Package Description
QFF,
Date Of Intro
2018-01-26
Compare 70V25L15PFG8 with alternatives
Compare 7025L15FG with alternatives