70V24S35PFG8 vs 70V24L35PFGI feature comparison

70V24S35PFG8 Renesas Electronics Corporation

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70V24L35PFGI Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Package Description TQFP-100 LFQFP,
Reach Compliance Code compliant compliant
Access Time-Max 35 ns 35 ns
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX16 4KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code QFP
Pin Count 100
ECCN Code EAR99
HTS Code 8542.32.00.41
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-609 Code e3
Length 14 mm
Moisture Sensitivity Level 3
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Terminal Finish Matte Tin (Sn)
Terminal Pitch 0.5 mm
Width 14 mm

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