70V16L20JI8
vs
IDT7016L20JGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68
QCCJ,
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
e3
Memory Density
147456 bit
147456 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
9
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
2
Number of Terminals
68
68
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16KX9
16KX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
Standby Voltage-Min
3 V
Supply Current-Max
0.195 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
1
1
Part Package Code
LCC
Pin Count
68
Length
24.2062 mm
Seated Height-Max
4.57 mm
Width
24.2062 mm
Compare 70V16L20JI8 with alternatives
Compare IDT7016L20JGI8 with alternatives