70V07L25JG vs 70V07L25PF9 feature comparison

70V07L25JG Renesas Electronics Corporation

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70V07L25PF9 Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Package Description 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
Reach Compliance Code compliant compliant
Access Time-Max 25 ns 25 ns
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 Code S-PQCC-N68 S-PQFP-G80
JESD-609 Code e3 e0
Length 24.2062 mm 14 mm
Memory Density 262144 bit 262144 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 68 80
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCN LQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form NO LEAD GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD QUAD
Width 24.2062 mm 14 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code QFP
Pin Count 80
ECCN Code EAR99
HTS Code 8542.32.00.41
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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