70V06S25PFGI vs 7006S25JG feature comparison

70V06S25PFGI Integrated Device Technology Inc

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7006S25JG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP LCC
Package Description LQFP, QCCJ, LDCC68,1.0SQ
Pin Count 64 68
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code S-PQFP-G64 S-PQCC-J68
JESD-609 Code e3 e3
Length 14 mm 24.2062 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 64 68
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16KX8 16KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QCCJ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.572 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn) - annealed
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 14 mm 24.2062 mm
Base Number Matches 3 6
I/O Type COMMON
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code LDCC68,1.0SQ
Standby Current-Max 0.015 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.265 mA

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