70V06L35PF8
vs
7006L20J
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TQFP
|
PLCC
|
Package Description |
TQFP-64
|
0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68
|
Pin Count |
64
|
68
|
Manufacturer Package Code |
PN64
|
PL68
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
20 ns
|
Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PQFP-G64
|
S-PQCC-J68
|
JESD-609 Code |
e0
|
e0
|
Length |
14 mm
|
24.2062 mm
|
Memory Density |
131072 bit
|
131072 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
64
|
68
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
16KX8
|
16KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
QCCJ
|
Package Equivalence Code |
QFP64,.66SQ,32
|
LDCC68,1.0SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
240
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
4.572 mm
|
Standby Current-Max |
0.0025 A
|
0.0015 A
|
Standby Voltage-Min |
2 V
|
2 V
|
Supply Current-Max |
0.155 mA
|
0.24 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
0.8 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
14 mm
|
24.2062 mm
|
Base Number Matches |
2
|
19
|
|
|
|
Compare 70V06L35PF8 with alternatives
Compare 7006L20J with alternatives