70V05L55GGI
vs
IDT7005L55PF8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PGA
QFP
Package Description
CERAMIC, PGA-68
14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Pin Count
68
64
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-CPGA-P68
S-PQFP-G64
JESD-609 Code
e3
e0
Length
29.464 mm
14 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
68
64
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
LQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.207 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
0.8 mm
Terminal Position
PERPENDICULAR
QUAD
Width
29.464 mm
14 mm
Base Number Matches
2
1
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP
I/O Type
COMMON
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Output Enable
YES
Package Equivalence Code
QFP64,.66SQ,32
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.0015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.21 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare 70V05L55GGI with alternatives
Compare IDT7005L55PF8 with alternatives