70V05L25PFG8
vs
IDT70V05L25JG8
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64
|
QCCJ,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQCC-J68
|
| JESD-609 Code |
e3
|
e3
|
| Length |
14 mm
|
24.2062 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
DUAL-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
68
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
1.6 mm
|
4.572 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
24.2062 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
68
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 70V05L25PFG8 with alternatives
Compare IDT70V05L25JG8 with alternatives