70T9159L15PF8
vs
IDT70V15L15PF
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TQFP
|
QFP
|
Package Description |
,
|
14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
|
Pin Count |
100
|
80
|
Manufacturer Package Code |
PN100
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
JESD-609 Code |
e0
|
e0
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
Base Number Matches |
1
|
1
|
Access Time-Max |
|
15 ns
|
I/O Type |
|
COMMON
|
JESD-30 Code |
|
S-PQFP-G80
|
Length |
|
14 mm
|
Memory Density |
|
73728 bit
|
Memory Width |
|
9
|
Number of Functions |
|
1
|
Number of Ports |
|
2
|
Number of Terminals |
|
80
|
Number of Words |
|
8192 words
|
Number of Words Code |
|
8000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
8KX9
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LQFP
|
Package Equivalence Code |
|
QFP80,.64SQ
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.6 mm
|
Standby Current-Max |
|
0.0025 A
|
Standby Voltage-Min |
|
3 V
|
Supply Current-Max |
|
0.185 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
Width |
|
14 mm
|
|
|
|
Compare 70T9159L15PF8 with alternatives
Compare IDT70V15L15PF with alternatives