70T659S12DRI vs IDT70V659S12DR9 feature comparison

70T659S12DRI Integrated Device Technology Inc

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IDT70V659S12DR9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PQFP QFP
Package Description PLASTIC, QFP-208 28 X 28 MM, 3.50 MM HEIGHT, PLASTIC, QFP-208
Pin Count 208 208
Manufacturer Package Code DR208
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
I/O Type COMMON
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0 e0
Length 28 mm 28 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 208 208
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.395 mA
Supply Voltage-Max (Vsup) 2.6 V 3.45 V
Supply Voltage-Min (Vsup) 2.4 V 3.15 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 1 1
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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