70T659S10BFG8
vs
70T659S10BFI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
FBGA-208
FBGA-208
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B208
S-PBGA-B208
JESD-609 Code
e1
e0
Memory Density
4718592 bit
4718592 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Equivalence Code
BGA208,17X17,32
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.01 A
0.02 A
Standby Voltage-Min
2.4 V
2.4 V
Supply Current-Max
0.405 mA
0.445 mA
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Base Number Matches
1
2
Part Package Code
CABGA
Pin Count
208
Manufacturer Package Code
BF208
Length
15 mm
Seated Height-Max
1.5 mm
Width
15 mm
Compare 70T659S10BFG8 with alternatives
Compare 70T659S10BFI with alternatives