70T651S10BFI8
vs
70T651S10BFGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Part Package Code
CABGA
CABGA
Pin Count
208
208
Manufacturer Package Code
BF208
BFG208
Reach Compliance Code
not_compliant
compliant
ECCN Code
NLR
NLR
HTS Code
8542320041
8542320041
Samacsys Description
The 70T651 is a high-speed 256K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 72-bit-or-more word system which would result in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.
Samacsys Manufacturer
Renesas Electronics
Renesas Electronics
Samacsys Modified On
2023-10-24 19:30:29
Total Weight
539.4
Category CO2 Kg
12
CO2
6472.799999999999
Compliance Temperature Grade
Industrial: -40C to +85C
Candidate List Date
2024-01-23
SVHC Over MCV
7439-92-1
CAS Accounted for Wt
78
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
1333-86-4, 7439-92-1, 7440-02-0
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.22
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B208
S-PBGA-B208
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX36
256KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA208,17X17,32
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.2 mm
Standby Current-Max
0.02 A
0.02 A
Standby Voltage-Min
2.4 V
2.4 V
Supply Current-Max
0.445 mA
0.445 mA
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
15 mm
15 mm
Base Number Matches
1
2
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