70T633S12BF8 vs 70T3339S133BFGI feature comparison

70T633S12BF8 Integrated Device Technology Inc

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70T3339S133BFGI Integrated Device Technology Inc

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No Yes
Transferred Transferred
INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
CABGA CABGA
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208
208 208
BF208 BFG208
not_compliant compliant
3A991.B.2.A 3A991.B.2.A
8542.32.00.41 8542.32.00.41
12 ns 4.2 ns
COMMON COMMON
S-PBGA-B208 S-CBGA-B208
e0 e1
15 mm 15 mm
9437184 bit 9437184 bit
MULTI-PORT SRAM MULTI-PORT SRAM
18 18
3 3
1 1
2 2
208 208
524288 words 524288 words
512000 512000
ASYNCHRONOUS SYNCHRONOUS
70 °C 85 °C
-40 °C
512KX18 512KX18
3-STATE 3-STATE
PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
LFBGA LFBGA
BGA208,17X17,32 BGA208,17X17,32
SQUARE SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
PARALLEL PARALLEL
225 260
Not Qualified Not Qualified
1.5 mm 1.7 mm
0.01 A 0.02 A
2.4 V 2.4 V
0.355 mA 0.45 mA
2.6 V 2.6 V
2.4 V 2.4 V
2.5 V 2.5 V
YES YES
CMOS CMOS
COMMERCIAL INDUSTRIAL
TIN LEAD TIN SILVER COPPER
BALL BALL
0.8 mm 0.8 mm
BOTTOM BOTTOM
20 30
15 mm 15 mm
2 2
FLOW-THROUGH OR PIPELINED ARCHITECTURE
133 MHz

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Compare 70T3339S133BFGI with alternatives