70T631S8BF8
vs
IDT70T631S8BFG
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208
|
15 X 15 MM, 1.40 MM HIEGHT, 0.80 MM, PITCH, GREEN, FPBGA-208
|
Pin Count |
208
|
208
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
8 ns
|
8 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
JESD-609 Code |
e0
|
e1
|
Length |
15 mm
|
15 mm
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
18
|
18
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
208
|
208
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX18
|
256KX18
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA208,17X17,32
|
BGA208,17X17,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Standby Current-Max |
0.01 A
|
0.01 A
|
Standby Voltage-Min |
2.4 V
|
2.4 V
|
Supply Current-Max |
0.475 mA
|
0.475 mA
|
Supply Voltage-Max (Vsup) |
2.6 V
|
2.6 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
Width |
15 mm
|
15 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 70T631S8BF8 with alternatives
Compare IDT70T631S8BFG with alternatives