70T631S12BF
vs
IDT70T631S12BFI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
BGA
Package Description
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208
Pin Count
208
208
Manufacturer Package Code
BF208
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Total Weight
539.4
539.4
Category CO2 Kg
12
12
CO2
6472.799999999999
6472.799999999999
Compliance Temperature Grade
Commercial: +0C to +70C
Industrial: -40C to +85C
Candidate List Date
2024-01-23
2024-01-23
SVHC Over MCV
7439-92-1
7439-92-1
CAS Accounted for Wt
78
78
CA Prop 65 Presence
YES
YES
CA Prop 65 CAS Numbers
1333-86-4, 7439-92-1, 7440-02-0
1333-86-4, 7439-92-1, 7440-02-0
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V6.01
CMRT V2.03a
Access Time-Max
12 ns
12 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B208
S-PBGA-B208
JESD-609 Code
e0
e0
Length
15 mm
15 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX18
256KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA208,17X17,32
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Standby Current-Max
0.01 A
0.02 A
Standby Voltage-Min
2.4 V
2.4 V
Supply Current-Max
0.355 mA
0.395 mA
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
15 mm
15 mm
Base Number Matches
2
1
Compare 70T631S12BF with alternatives
Compare IDT70T631S12BFI8 with alternatives