70T3599S166DRG8
vs
IDT70T3599S166BF
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
FQFP,
|
TFBGA, BGA208,17X17,32
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
12 ns
|
12 ns
|
| Additional Feature |
PIPELINED OR FLOW-THROUGH ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B208
|
| JESD-609 Code |
e3
|
e0
|
| Length |
28 mm
|
15 mm
|
| Memory Density |
4718592 bit
|
4718592 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
36
|
36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
208
|
208
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
128KX36
|
128KX36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
4.1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2.6 V
|
2.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn63Pb37)
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
28 mm
|
15 mm
|
| Base Number Matches |
1
|
8
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
208
|
| Clock Frequency-Max (fCLK) |
|
166 MHz
|
| I/O Type |
|
COMMON
|
| Moisture Sensitivity Level |
|
3
|
| Number of Ports |
|
2
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA208,17X17,32
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.015 A
|
| Standby Voltage-Min |
|
2.4 V
|
| Supply Current-Max |
|
0.45 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare 70T3599S166DRG8 with alternatives
Compare IDT70T3599S166BF with alternatives