70T3589S166BF vs IDT70T3589S166BCG feature comparison

70T3589S166BF Renesas Electronics Corporation

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IDT70T3589S166BCG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Pin Count 208 256
Manufacturer Package Code BF208
Reach Compliance Code not_compliant compliant
ECCN Code NLR 3A991.B.2.A
HTS Code 8542320041 8542.32.00.41
Samacsys Manufacturer Renesas Electronics
Access Time-Max 12 ns 12 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz 166 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B256
JESD-609 Code e0 e1
Length 15 mm 17 mm
Memory Density 2359296 bit 2359296 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 256
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX36 64KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LBGA
Package Equivalence Code BGA208,17X17,32 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.7 mm
Standby Current-Max 0.015 A 0.015 A
Standby Voltage-Min 2.4 V 2.4 V
Supply Current-Max 0.45 mA 0.45 mA
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 15 mm 17 mm
Base Number Matches 2 3
Package Description LBGA, BGA256,16X16,40

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