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70T3399S200BC8 vs IDT70V3399S133BC feature comparison

70T3399S200BC8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70V3399S133BC Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 LBGA, BGA256,16X16,40
Pin Count 256 256
Manufacturer Package Code BC256
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Memory Density 2359296 bit 2359296 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 256 256
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX18 128KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.7 mm
Standby Current-Max 0.015 A 0.03 A
Standby Voltage-Min 2.4 V 3.15 V
Supply Current-Max 0.525 mA 0.4 mA
Supply Voltage-Max (Vsup) 2.6 V 3.45 V
Supply Voltage-Min (Vsup) 2.4 V 3.15 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 17 mm 17 mm
Base Number Matches 2 1
Memory » SRAMs
Memory » SRAMs

Compare 70T3399S200BC8 with alternatives

Compare IDT70V3399S133BC with alternatives