70T3399S166BFI vs IDT70T3399S166BFI feature comparison

70T3399S166BFI Integrated Device Technology Inc

Buy Now Datasheet

IDT70T3399S166BFI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA,
Pin Count 208 208
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 2359296 bit 2359296 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 208 208
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX18 128KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1

Compare 70T3399S166BFI with alternatives

Compare IDT70T3399S166BFI with alternatives