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70T3339S200BC8 vs CYD04S18V-133BBI feature comparison

70T3339S200BC8 Integrated Device Technology Inc

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CYD04S18V-133BBI Cypress Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code CABGA BGA
Package Description 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count 256 256
Manufacturer Package Code BC256
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 4 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Memory Density 9437184 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 256 256
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX18 256KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.7 mm
Standby Current-Max 0.015 A 0.075 A
Standby Voltage-Min 2.4 V 3.14 V
Supply Current-Max 0.525 mA 0.3 mA
Supply Voltage-Max (Vsup) 2.6 V 1.9 V
Supply Voltage-Min (Vsup) 2.4 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 17 mm 17 mm
Base Number Matches 2 1
Memory » SRAMs
Memory » SRAMs

Compare 70T3339S200BC8 with alternatives

Compare CYD04S18V-133BBI with alternatives