70T3339S133BF8 vs IDT70V7319S133BFI feature comparison

70T3339S133BF8 Integrated Device Technology Inc

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IDT70V7319S133BFI Integrated Device Technology Inc

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No No
No No
Transferred Transferred
INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
CABGA BGA
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 TFBGA, BGA208,17X17,50
208 208
BF208
not_compliant not_compliant
3A991.B.2.A 3A991.B.2.A
8542.32.00.41 8542.32.00.41
15 ns 15 ns
FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
133 MHz 133 MHz
COMMON COMMON
S-PBGA-B208 S-PBGA-B208
e0 e0
15 mm 15 mm
9437184 bit 4718592 bit
MULTI-PORT SRAM MULTI-PORT SRAM
18 18
3 3
1 1
2 2
208 208
524288 words 262144 words
512000 256000
SYNCHRONOUS SYNCHRONOUS
70 °C 85 °C
-40 °C
512KX18 256KX18
3-STATE 3-STATE
PLASTIC/EPOXY PLASTIC/EPOXY
TFBGA TFBGA
BGA208,17X17,32 BGA208,17X17,50
SQUARE SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
PARALLEL PARALLEL
225 225
Not Qualified Not Qualified
1.2 mm 1.2 mm
0.015 A 0.04 A
2.4 V 3.15 V
0.37 mA 0.675 mA
2.6 V 3.45 V
2.4 V 3.15 V
2.5 V 3.3 V
YES YES
CMOS CMOS
COMMERCIAL INDUSTRIAL
TIN LEAD Tin/Lead (Sn63Pb37)
BALL BALL
0.8 mm 0.8 mm
BOTTOM BOTTOM
20 20
15 mm 15 mm
2 1

Compare 70T3339S133BF8 with alternatives

Compare IDT70V7319S133BFI with alternatives