70T15S17PFI8
vs
7015S17PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
QFP
Package Description
,
TQFP-80
Pin Count
80
80
Manufacturer Package Code
PN80
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
JESD-609 Code
e0
e0
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Base Number Matches
1
1
Access Time-Max
17 ns
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 Code
S-PQFP-G80
Length
14 mm
Memory Density
73728 bit
Memory Width
9
Number of Functions
1
Number of Terminals
80
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8KX9
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Compare 70T15S17PFI8 with alternatives
Compare 7015S17PF9 with alternatives