70T15S17PFI8 vs 7015S17PF9 feature comparison

70T15S17PFI8 Integrated Device Technology Inc

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7015S17PF9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Package Description , TQFP-80
Pin Count 80 80
Manufacturer Package Code PN80
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
JESD-609 Code e0 e0
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Moisture Sensitivity Level 3 3
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Base Number Matches 1 1
Access Time-Max 17 ns
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-30 Code S-PQFP-G80
Length 14 mm
Memory Density 73728 bit
Memory Width 9
Number of Functions 1
Number of Terminals 80
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8KX9
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Compare 70T15S17PFI8 with alternatives

Compare 7015S17PF9 with alternatives