70T15S17PFI
vs
7015S17PF9
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TQFP
|
QFP
|
Package Description |
,
|
TQFP-80
|
Pin Count |
80
|
80
|
Manufacturer Package Code |
PN80
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
JESD-609 Code |
e0
|
e0
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Base Number Matches |
1
|
1
|
Access Time-Max |
|
17 ns
|
Additional Feature |
|
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
JESD-30 Code |
|
S-PQFP-G80
|
Length |
|
14 mm
|
Memory Density |
|
73728 bit
|
Memory Width |
|
9
|
Number of Functions |
|
1
|
Number of Terminals |
|
80
|
Number of Words |
|
8192 words
|
Number of Words Code |
|
8000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
8KX9
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LQFP
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
14 mm
|
|
|
|
Compare 70T15S17PFI with alternatives
Compare 7015S17PF9 with alternatives