70P3599S166BC
vs
IDT70T3599S166BC8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
,
LBGA, BGA256,16X16,40
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
256
Access Time-Max
12 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
Memory Density
4718592 bit
Memory IC Type
MULTI-PORT SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
Number of Terminals
256
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.45 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
Compare 70P3599S166BC with alternatives
Compare IDT70T3599S166BC8 with alternatives