709269L9G
vs
709269L9G8
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PGA
|
|
Package Description |
PGA-108
|
PGA-108
|
Pin Count |
108
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
9 ns
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
66 MHz
|
66 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-CPGA-P108
|
X-CPGA-P108
|
JESD-609 Code |
e0
|
e3
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
APPLICATION SPECIFIC SRAM
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
108
|
108
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
16KX16
|
16KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
Package Shape |
SQUARE
|
UNSPECIFIED
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.005 A
|
0.005 A
|
Standby Voltage-Min |
4.5 V
|
4.5 V
|
Supply Current-Max |
0.35 mA
|
0.35 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Matte Tin (Sn) - annealed
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 709269L9G with alternatives
Compare 709269L9G8 with alternatives