709179S12PFI8
vs
709179L12PFI8
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
TQFP
|
| Package Description |
,
|
QFP,
|
| Pin Count |
100
|
100
|
| Manufacturer Package Code |
PN100
|
PN100
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| JESD-609 Code |
e0
|
e0
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
240
|
240
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Base Number Matches |
1
|
1
|
| Access Time-Max |
|
25 ns
|
| Additional Feature |
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
| JESD-30 Code |
|
S-PQFP-G100
|
| Memory Density |
|
294912 bit
|
| Memory Width |
|
9
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
100
|
| Number of Words |
|
32768 words
|
| Number of Words Code |
|
32000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
32KX9
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK
|
| Parallel/Serial |
|
PARALLEL
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
QUAD
|
|
|
|
Compare 709179S12PFI8 with alternatives
Compare 709179L12PFI8 with alternatives