709179L12PF9
vs
709179L12PF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
TQFP
Package Description
QFP,
QFP,
Pin Count
100
100
Manufacturer Package Code
PN100
PN100
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
12 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
e0
Memory Density
294912 bit
294912 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX9
32KX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
240
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
1
2
Length
14 mm
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
Compare 709179L12PF9 with alternatives
Compare 709179L12PF with alternatives