70825S45PFB vs 70825S35PF8 feature comparison

70825S45PFB Integrated Device Technology Inc

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70825S35PF8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP TQFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80 TQFP-80
Pin Count 80 80
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 35 ns
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e0
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 80 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LQFP
Package Equivalence Code QFP80,.64SQ QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.03 A 0.015 A
Supply Current-Max 0.4 mA 0.34 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 20
Base Number Matches 1 1
Manufacturer Package Code PN80
Additional Feature AUTOMATIC POWER-DOWN
Length 14 mm
Seated Height-Max 1.6 mm
Width 14 mm

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