70825S20GI
vs
70825L20PFI8
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
JESD-30 Code
S-PPGA-P84
S-PQFP-G80
JESD-609 Code
e0
e0
Memory Density
131072 bit
131072 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
STANDARD SRAM
Memory Width
16
16
Number of Terminals
84
80
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX16
8KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
PGA
LQFP
Package Equivalence Code
PGA84M,11X11
QFP80,.64SQ
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.015 A
0.005 A
Supply Current-Max
0.38 mA
0.33 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
PERPENDICULAR
QUAD
Base Number Matches
1
1
Part Package Code
TQFP
Package Description
TQFP-80
Pin Count
80
Manufacturer Package Code
PN80
Length
14 mm
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
240
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
Compare 70825S20GI with alternatives
Compare 70825L20PFI8 with alternatives