70825S20G vs 70825L20PF9 feature comparison

70825S20G Integrated Device Technology Inc

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70825L20PF9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA TQFP
Package Description 1.120 X 1.12 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-84 LQFP,
Pin Count 84 80
Manufacturer Package Code GU84 PN80
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-CPGA-P84 S-PQFP-G80
JESD-609 Code e0 e0
Length 27.94 mm 14 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 84 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX16 8KX16
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA LQFP
Package Equivalence Code PGA84M,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified
Seated Height-Max 5.207 mm 1.6 mm
Standby Current-Max 0.015 A
Supply Current-Max 0.38 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position PERPENDICULAR QUAD
Width 27.94 mm 14 mm
Base Number Matches 4 2
Additional Feature AUTOMATIC POWER-DOWN

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