70825L25PF
vs
IDT70825L25PF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
QFP
Package Description
14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
TQFP-80
Pin Count
80
80
Manufacturer Package Code
PN80
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
S-PQFP-G80
S-PQFP-G80
JESD-609 Code
e0
e0
Length
14 mm
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
80
80
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX16
8KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LQFP
Package Equivalence Code
QFP80,.64SQ
QFP80,.64SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.0015 A
0.0015 A
Supply Current-Max
0.31 mA
0.31 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
20
Width
14 mm
14 mm
Base Number Matches
1
1
Additional Feature
AUTOMATIC POWER-DOWN
Compare 70825L25PF with alternatives
Compare IDT70825L25PF with alternatives