70825L20PFI vs IDT70825L20PF9 feature comparison

70825L20PFI Integrated Device Technology Inc

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IDT70825L20PF9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Package Description TQFP-80 TQFP-80
Pin Count 80 80
Manufacturer Package Code PN80
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e0
Length 14 mm 14 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 80 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.33 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1
Additional Feature AUTOMATIC POWER-DOWN

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