70825L20PFI vs 70825S20PFI feature comparison

70825L20PFI Integrated Device Technology Inc

Buy Now Datasheet

70825S20PFI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP TQFP
Package Description TQFP-80 QFP, QFP80,.64SQ
Pin Count 80 80
Manufacturer Package Code PN80 PN80
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e0
Length 14 mm
Memory Density 131072 bit 131072 bit
Memory IC Type STANDARD SRAM APPLICATION SPECIFIC SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 80 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QFP
Package Equivalence Code QFP80,.64SQ QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Standby Current-Max 0.005 A 0.015 A
Supply Current-Max 0.33 mA 0.38 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm
Base Number Matches 5 3

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Compare 70825S20PFI with alternatives