70825L20GI vs 70825S20PF feature comparison

70825L20GI Integrated Device Technology Inc

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70825S20PF Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PPGA-P84 S-PQFP-G80
JESD-609 Code e0 e0
Memory Density 131072 bit 131072 bit
Memory IC Type APPLICATION SPECIFIC SRAM STANDARD SRAM
Memory Width 16 16
Number of Terminals 84 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code PGA QFP
Package Equivalence Code PGA84M,11X11 QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.015 A
Supply Current-Max 0.33 mA 0.38 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position PERPENDICULAR QUAD
Base Number Matches 1 1
Part Package Code TQFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
Pin Count 80
Manufacturer Package Code PN80
Length 14 mm
Moisture Sensitivity Level 3
Number of Functions 1
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm

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