7026L20JB vs 7026L20JGI8 feature comparison

7026L20JB Integrated Device Technology Inc

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7026L20JGI8 Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code LCC
Package Description QCCJ, LDCC84,1.2SQ
Pin Count 84
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 20 ns 20 ns
I/O Type COMMON
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type MULTI-PORT SRAM DUAL-PORT SRAM
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Ports 2
Number of Terminals 84 84
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 16KX16 16KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Screening Level MIL-PRF-38535
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.315 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 3 1

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