7026L15JG8
vs
7026L15JG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
1.150 X 1.150 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-84
1.150 X 1.150 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-84
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
S-PQCC-J84
S-PQCC-J84
JESD-609 Code
e3
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
84
84
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX16
16KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
2
4
Compare 7026L15JG8 with alternatives
Compare 7026L15JG with alternatives