70261S55PFG8
vs
70261L55PFG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
RENESAS ELECTRONICS CORP
Package Description
QFP,
14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
55 ns
55 ns
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Memory Density
262144 bit
262144 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX16
16KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
1
2
Compare 70261S55PFG8 with alternatives
Compare 70261L55PFG with alternatives