7024L55JGB8
vs
IDT7024L55JGI
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
QCCJ,
|
QCCJ,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
55 ns
|
55 ns
|
JESD-30 Code |
S-PQCC-J84
|
S-PQCC-J84
|
JESD-609 Code |
e3
|
e3
|
Length |
29.3116 mm
|
29.3116 mm
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
84
|
84
|
Number of Words |
4096 words
|
4096 words
|
Number of Words Code |
4000
|
4000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
4KX16
|
4KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535 Class B
|
|
Seated Height-Max |
4.572 mm
|
4.572 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
29.3116 mm
|
29.3116 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
LCC
|
Pin Count |
|
84
|
Additional Feature |
|
4K X 16 DUAL PORT SRAM
|
|
|
|
Compare 7024L55JGB8 with alternatives
Compare IDT7024L55JGI with alternatives