7024L25JG8
vs
7024S25JGB8
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
QCCJ,
|
QCCJ,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
|
| JESD-30 Code |
S-PQCC-J84
|
S-PQCC-J84
|
| JESD-609 Code |
e3
|
e3
|
| Length |
29.3116 mm
|
29.3116 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
DUAL-PORT SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
84
|
84
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
4KX16
|
4KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
4.572 mm
|
4.572 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
29.3116 mm
|
29.3116 mm
|
| Base Number Matches |
1
|
1
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare 7024L25JG8 with alternatives
Compare 7024S25JGB8 with alternatives