7008S55JGI8
vs
IDT7008L55JB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
2018-01-26
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
LCC
Package Description
QCCJ, LDCC84,1.2SQ
Pin Count
84
Access Time-Max
55 ns
I/O Type
COMMON
JESD-30 Code
S-PQCC-J84
JESD-609 Code
e0
Length
29.3116 mm
Memory Density
524288 bit
Memory Width
8
Moisture Sensitivity Level
1
Number of Functions
1
Number of Ports
2
Number of Terminals
84
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
64KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
QCCJ
Package Equivalence Code
LDCC84,1.2SQ
Package Shape
SQUARE
Package Style
CHIP CARRIER
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535
Seated Height-Max
4.57 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.21 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
29.3116 mm
Compare 7008S55JGI8 with alternatives
Compare IDT7008L55JB with alternatives