7007S25PFGB
vs
IDT7007S25PFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
TQFP-80
Pin Count
80
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-XQFP-G80
S-PQFP-G80
JESD-609 Code
e3
e3
Length
14 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Ports
2
2
Number of Terminals
80
80
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP80,.64SQ
QFP80,.64SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
1.6 mm
Standby Current-Max
0.03 A
0.015 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.345 mA
0.305 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
14 mm
Base Number Matches
1
1
Compare 7007S25PFGB with alternatives
Compare IDT7007S25PFG8 with alternatives