7007S25PFG
vs
70V07L25PFI8
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-80
14 X 14 MM, 1.40 MM HEIGHT, TQFP-80
Reach Compliance Code
compliant
not_compliant
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQFP-G80
S-PQFP-G80
JESD-609 Code
e3
e0
Length
14 mm
14 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
80
80
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LQFP
Package Equivalence Code
QFP80,.64SQ
QFP80,.64SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.015 A
0.003 A
Standby Voltage-Min
4.5 V
3 V
Supply Current-Max
0.305 mA
0.185 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Width
14 mm
14 mm
Base Number Matches
2
1
Pbfree Code
No
Part Package Code
TQFP
Pin Count
80
Manufacturer Package Code
PN80
ECCN Code
EAR99
HTS Code
8542.32.00.41
Compare 7007S25PFG with alternatives
Compare 70V07L25PFI8 with alternatives