7007S25GI
vs
IDT7007S25JGB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PGA
LCC
Package Description
PGA, PGA68,11X11
QCCJ, PGA68,11X11
Pin Count
68
68
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-CPGA-P68
S-PQCC-J68
JESD-609 Code
e0
e3
Length
29.464 mm
24.2062 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
68
68
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
QCCJ
Package Equivalence Code
PGA68,11X11
PGA68,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.207 mm
4.572 mm
Standby Current-Max
0.03 A
0.03 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.345 mA
0.345 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
PIN/PEG
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
PERPENDICULAR
QUAD
Width
29.464 mm
24.2062 mm
Base Number Matches
4
2
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Screening Level
MIL-PRF-38535
Time@Peak Reflow Temperature-Max (s)
30
Compare 7007S25GI with alternatives
Compare IDT7007S25JGB with alternatives