7007L25PFB8 vs 7007S25PFGI8 feature comparison

7007L25PFB8 Integrated Device Technology Inc

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7007S25PFGI8 Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e3
Memory Density 262144 bit 262144 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Ports 2 2
Number of Terminals 80 80
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP80,.64SQ QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.01 A 0.03 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.305 mA 0.345 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 30
Base Number Matches 1 1
Package Description TQFP-80
Number of Functions 1
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

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Compare 7007S25PFGI8 with alternatives