7006S55PFG8 vs IDT7006L55PFI9 feature comparison

7006S55PFG8 Renesas Electronics Corporation

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IDT7006L55PFI9 Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Package Description TQFP-64 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Reach Compliance Code compliant compliant
Access Time-Max 55 ns 55 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Length 14 mm 14 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16KX8 16KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.6 mm 1.6 mm
Supply Current-Max 0.285 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code QFP
Pin Count 64
ECCN Code EAR99
HTS Code 8542.32.00.41
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 7006S55PFG8 with alternatives

Compare IDT7006L55PFI9 with alternatives