7006L35GGB vs 7006L35JG8 feature comparison

7006L35GGB Integrated Device Technology Inc

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7006L35JG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA
Package Description PGA, PGA68,11X11 QCCJ,
Pin Count 68
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
I/O Type COMMON
JESD-30 Code S-CPGA-P68 S-PQCC-J68
JESD-609 Code e3 e3
Length 27.889 mm 24.2062 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 2
Number of Terminals 68 68
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA QCCJ
Package Equivalence Code PGA68,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 2.413 mm 4.572 mm
Standby Current-Max 0.004 A
Standby Voltage-Min 2 V
Supply Current-Max 0.25 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form PIN/PEG J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 27.889 mm 24.2062 mm
Base Number Matches 3 1

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Compare 7006L35JG8 with alternatives