7006L25FB
vs
7006S25PFB
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
FPACK
|
QFP
|
Package Description |
0.970 X 0.970 INCH, 0.080 INCH HEIGHT, QFP-68
|
LQFP, QFP64,.66SQ,32
|
Pin Count |
68
|
64
|
Manufacturer Package Code |
FP68
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Date Of Intro |
1992-01-01
|
|
Access Time-Max |
25 ns
|
25 ns
|
Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PQFP-F68
|
S-PQFP-G64
|
JESD-609 Code |
e0
|
e0
|
Length |
24.0792 mm
|
14 mm
|
Memory Density |
131072 bit
|
131072 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
68
|
64
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
16KX8
|
16KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFF
|
LQFP
|
Package Equivalence Code |
QFL68,.95SQ
|
QFP64,.66SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535
|
MIL-PRF-38535
|
Seated Height-Max |
3.683 mm
|
1.6 mm
|
Standby Current-Max |
0.004 A
|
0.03 A
|
Standby Voltage-Min |
2 V
|
4.5 V
|
Supply Current-Max |
0.28 mA
|
0.34 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.0792 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 7006L25FB with alternatives
Compare 7006S25PFB with alternatives