7006L20PFGB8
vs
7006S20GGI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LQFP,
PGA,
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
JESD-30 Code
S-PQFP-G64
S-CPGA-P68
JESD-609 Code
e3
e3
Length
14 mm
27.889 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
64
68
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
16KX8
16KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
LQFP
PGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Seated Height-Max
1.6 mm
2.413 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
QUAD
PERPENDICULAR
Width
14 mm
27.889 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
PGA
Pin Count
68
Compare 7006L20PFGB8 with alternatives
Compare 7006S20GGI with alternatives