7005S55PFGB8
vs
7005L55PFG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
RENESAS ELECTRONICS CORP
Package Description
QFP,
14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Memory Density
65536 bit
65536 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
2
I/O Type
COMMON
JESD-609 Code
e3
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
QFP64,.66SQ,32
Standby Current-Max
0.0015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.21 mA
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
0.8 mm
Compare 7005S55PFGB8 with alternatives
Compare 7005L55PFG with alternatives